期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2007, vol.19, no.1 2007, vol.19, no.2 2007, vol.19, no.3 2007, vol.19, no.4

题名作者出版年年卷期
Dissolution of copper on Sn-Ag-Cu system lead free solderGoro Izuta; Tsuyoshi Tanabe; Katsuaki Suganuma20072007, vol.19, no.2
Strain range fatigue life assessment of lead-free solder interconnects subject to temperature cycle loadingMichael Osterman; Michael Pecht20072007, vol.19, no.2
Global environmental impact assessment of the Pb-free shiftAnders S. G. Andrae; Norihiro Itsubo; Atsushi Inaba20072007, vol.19, no.2
High-cycle fatigue testing of Pb-free solder jointsN. Barry; I. P. Jones; T. Hirst; I. M. Fox; J. Robins20072007, vol.19, no.2



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