期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2007, vol.129, no.1 2007, vol.129, no.2 2007, vol.129, no.3 2007, vol.129, no.4

题名作者出版年年卷期
Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink ArrayGaowei Xu; Yingjun Cheng; Le Luo20072007, vol.129, no.4
An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis TechniquesThomas E. Salem; Stephen B. Bayne; Don Porschet20072007, vol.129, no.4
Simultaneous Electrothermal Test Method for Pyroelectric MicrosensorsBrian Smith; Cristina Amon20072007, vol.129, no.4
Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder JointsJohn H. L. Pang; F. X. Che20072007, vol.129, no.4
Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid CoolingZ. A. Williams; J. A. Roux20072007, vol.129, no.4
Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat SinkAbel Siu-Ho; Weilin Qu; Frank Pfefferkorn20072007, vol.129, no.4
A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip PackageJ. W. Wan; W. J. Zhang; D. J. Bergstrom20072007, vol.129, no.4
High Thermal Conductive Si{sub}3N{sub}4 Particle Filled Epoxy Composites With a Novel StructureHong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang20072007, vol.129, no.4
A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical PerformanceKaran Kacker; Thomas Sokol; Wansuk Yun; Madhavan Swaminathan; Suresh K. Sitaraman20072007, vol.129, no.4
A Systematic Approach to Predicting Critical Heat Flux for Inclined SpraysMilan Visaria; Issam Mudawar20072007, vol.129, no.4
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