期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2007, vol.129, no.1 2007, vol.129, no.2 2007, vol.129, no.3 2007, vol.129, no.4

题名作者出版年年卷期
Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics ModuleY. Pang; E. Scott; J. D. van Wyk; Z. Liang20072007, vol.129, no.1
Design Optimization and Reliability of PWB Level Electronic PackageMohammad Masum Hossain; Sudhakar G. Jagarkal; Dereje Agonafer; Menberu Lulu; Stefan Reh20072007, vol.129, no.1
An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding ProcessZone-Ching Lin; Chang-Cheng Chen20072007, vol.129, no.1
Shorter Field Life in Power Cycling for Organic PackagesS. B. Park; Izhar Z. Ahmed20072007, vol.129, no.1
Molecular Dynamics Simulation of Thermal Cycling Test in Electronic PackagingHai Bo Fan; Edward K. L. Chan; Cell K. Y. Wong; Matthew M. F. Yuen20072007, vol.129, no.1
Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn-3.5Ag Solder Alloy Under Cyclic Multiaxial StrainingXianjie Yang; Yan Luo; Qing Gao20072007, vol.129, no.1
Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia EffectsChao-Ming Lin; Win-Jin Chang; Te-Hua Fang20072007, vol.129, no.1
Effect of Test Conditions on Electromigration Reliability of Sn-Ag-Cu Flip-Chip Solder InterconnectsYi-Shao Lai; Chiu-Wen Lee; Chin-Li Kao20072007, vol.129, no.1
Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled SurfaceX. J. Wei; Y. K. Joshi; P. M. Ligrani20072007, vol.129, no.1
A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder BallsTadahiro Shibutani; Qiang Yu; Masaki Shiratori20072007, vol.129, no.1
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