期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2007, vol.129, no.1 2007, vol.129, no.2 2007, vol.129, no.3 2007, vol.129, no.4

题名作者出版年年卷期
Smeared-Property Models for Shock-Impact Reliability of Area-Array PackagesPradeep Lall; Dhananjay Panchagade; Yueli Liu; Wayne Johnson; Jeff Suhling20072007, vol.129, no.4
Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh EnvironmentsPradeep Lall; Nokibul Islam; John Evans; Jeff Suhling20072007, vol.129, no.4
Analytical and Experimental Characterization of Bonding Over Active CircuitryLi Zhang; Vijaylaxmi Gumaste; Anindya Poddar; Luu Nguyen; Gary Schulze20072007, vol.129, no.4
Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet ImpingementC. J. Fang; M. C. Wu; Y. M. Kuo; C. Y. Lee; C. H. Peng; Y. H. Hung20072007, vol.129, no.4
Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet ImpingementY. C. Lee; C. J. Fang; M. C. Wu; C. H. Peng; Y. H. Hung20072007, vol.129, no.4
On Moisture Diffusion Modeling Using Thermal-Moisture AnalogySamson Yoon; Bongtae Han; Zhaoyang Wang20072007, vol.129, no.4
An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder BallsKrishna Tunga; Suresh K. Sitaraman20072007, vol.129, no.4
Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray MicrotomographyHiroyuki Tsuritani; Toshihiko Sayama; Kentaro Uesugi; Takeshi Takayanagi; Takao Mori20072007, vol.129, no.4
Heat Conduction in Multilayered Rectangular DomainsJames Geer; Anand Desai; Bahgat Sammakia20072007, vol.129, no.4
A Systematic Approach to Predicting Critical Heat Flux for Inclined SpraysMilan Visaria; Issam Mudawar20072007, vol.129, no.4
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