期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2008, vol.20, no.1 2008, vol.20, no.2 2008, vol.20, no.3 2008, vol.20, no.4

题名作者出版年年卷期
Effect of strain on whisker growth in matte tinA. R. Southworth; C. E. Ho; A. Lee; K. N. Subramanian20082008, vol.20, no.1
Effect of interconnection area on shear strength of sintered joint with nano-silver pasteKun Qi; Xu Chen; Guo-Quan Lu20082008, vol.20, no.1
Microstructural changes of lead-free solder joints during long-term ageing, thermal cycling and vibration fatigueAndreas R. Fix; Wolfgang Nuchter; Jurgen Wilde20082008, vol.20, no.1
Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free soldersR. S. Lai; K. L. Lin; B. Salam20082008, vol.20, no.1



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