期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2008, vol.20, no.1 2008, vol.20, no.2 2008, vol.20, no.3 2008, vol.20, no.4

题名作者出版年年卷期
The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengthsJu Guo-kui; Wei Xi-cheng; Sun Peng; Liu Johan20082008, vol.20, no.3
Characterization of Sn7In4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC/PWB assemblyO. Nousiainen; T. Kangasvieri; R. Rautioaho; J. Vahakangas20082008, vol.20, no.3
Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPsMeng-Kuang Huang; Chiapyng Lee20082008, vol.20, no.3
A procedure for determining the high-speed stencil printing performance of solder pastes in an electronic service provider's environmentChristopher M. Greene; Krishnaswami Srihari20082008, vol.20, no.3
Solder paste characterisation: towards the development of quality control (QC) toolR. Durairaj; S. Mallik; N. N. Ekere20082008, vol.20, no.3
Silver thick film pastes for low temperature co-fired ceramics: impact of glass frit variationJayashri Bangali; Sunit Rane; Girish Phatak; Shashikala Gangal20082008, vol.20, no.3



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