期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2008, vol.20, no.1 2008, vol.20, no.2 2008, vol.20, no.3 2008, vol.20, no.4

题名作者出版年年卷期
Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloysM. Reid; J. Punch; M. Collins; C. Ryan20082008, vol.20, no.4
Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance - ANOVAK. Bukat; J. Sitek; R. Kisiel; Z. Moser; W. Gasior; M. Koscielski; J. Pstrus20082008, vol.20, no.4
Thermal profiling: a reflow process based on the heating factorJin Gang Gao; Yi Ping Wu; Han Ding; Nian Hong Wan20082008, vol.20, no.4
Hydrocarbon fluxes for ionic compound free soldering: improvement by peroxide additivesToshihiro Miyake; Masaru Ishida; Satoshi Inagaki20082008, vol.20, no.4
Workmanship standards and their application on ESA projectsBarrie D. Dunn20082008, vol.20, no.4



制造业外文文献服务平台