期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2008, vol.130, no.1 2008, vol.130, no.2 2008, vol.130, no.3 2008, vol.130, no.4

题名作者出版年年卷期
Reliability of Fine Pitch Sn-3.8Ag-0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCBDezhi Li; Changqing Liu; Paul P. Conway20082008, vol.130, no.1
Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill VolumeAniruddha Pal; Yogendra Joshi20082008, vol.130, no.1
Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale PackagesJason M. Brand; Salvatore A. Ruggero; Amip J. Shah20082008, vol.130, no.1
The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi MethodWen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng20082008, vol.130, no.1
Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array PackageAndy Perkins; Suresh K. Sitaraman20082008, vol.130, no.1
Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn-3.9Ag-0.6Cu Lead-Free SolderDavid M. Pierce; Sheri D. Sheppard; Arlo F. Fossum; Paul T. Vianco; Mike K. Neilsen20082008, vol.130, no.1
Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic ComponentsMark A. Trautman; Murli Tirumala; S. M. You20082008, vol.130, no.1
Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural ConvectionYung-Shin Tseng; Tzu-Ghen Hung; Bau-Shei Pei20082008, vol.130, no.1
Damage Initiation and Propagation in Voided Joints: Modeling and ExperimentLeila Jannesari Ladani; Abhijif Dasgupta20082008, vol.130, no.1
Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment SolderingWei Zhang20082008, vol.130, no.1
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