期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2008, vol.130, no.1 2008, vol.130, no.2 2008, vol.130, no.3 2008, vol.130, no.4

题名作者出版年年卷期
Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal LoadYan Zhang; Johan Liu; Ragnar Larsson20082008, vol.130, no.2
On Failure Mechanisms in Flip Chip Assembly - Part 2: Optimal Underfill and Interconnecting MaterialsYoonchan Oh; C. Steve Suh; Hung-Jue Sue20082008, vol.130, no.2
Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic LoadingSamson Yoon; Changsoo Jang; Bongtae Han20082008, vol.130, no.2
Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)A. D. Laws; Y. J. Chang; V. M. Bright; Y. C. Lee20082008, vol.130, no.2
On Failure Mechanisms in Flip Chip Assembly - Part 1: Short-Time Scale Wave MotionYoonchan Oh; C. Steve Suh; Hung-Jue Sue20082008, vol.130, no.2
Improved Method of CO{sub}2 Laser Cutting of Aluminum NitrideRaathai Molian; Pranav Shrotriya; Pal Molian20082008, vol.130, no.2
Board Level Drop Test Analysis Based on Modal Test and SimulationFang Liu; Guang Meng; Mei Zhao; Junfeng Zhao20082008, vol.130, no.2
Modeling of Resin Flow in Reinforced Dielectric PrepregsPavel Simacek; Suresh G. Advani; Kossi Zonvide; Leonard W. Barrett20082008, vol.130, no.2
Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics PackagingMelida Chin; S. Jack Hu; James R. Barber20082008, vol.130, no.2
Integrating Compact Thermal Models in CFD Simulations of Electronic PackagesRohit Dev Gupta; Vinayak Eswaran20082008, vol.130, no.2
12



制造业外文文献服务平台