期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2008, vol.130, no.1 2008, vol.130, no.2 2008, vol.130, no.3 2008, vol.130, no.4

题名作者出版年年卷期
Managing Thermal Emergencies in Disk-Based Storage SystemsYoungjae Kim; Jeonghwan Choi; Sudhanva Gurumurthi; Anand Sivasubramaniam20082008, vol.130, no.4
Compact Thermal Models: A Global ApproachMohamed-Nabil Sabry; Hossam Saleh; Abdejmeguid20082008, vol.130, no.4
Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling ApproachWataru Nakayama20082008, vol.130, no.4
Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image CorrelationS. B. Park; Chirag Shah; Jae B. Kwak; Changsoo Jang; Soonwan Chung; James M. Pitarresi20082008, vol.130, no.4
The Thermal Design of a Next Generation Data Center: A Conceptual ExpositionEmad Samadiani; Yogendra Joshi; Farrokh Mistree20082008, vol.130, no.4
Direct Silver to Copper Bonding ProcessPin J. Wang; Jong S. Kim; Chin C. Lee20082008, vol.130, no.4
Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat SinkWataru Nakayama20082008, vol.130, no.4
Flip-Chip Interconnect for Coplanar Strip LinesYoung K. Song; Chin C. Lee20082008, vol.130, no.4
Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin SpacesKarl J. L. Geisler; Avram Bar-Cohen20082008, vol.130, no.4
An Alternative Method for the Cooling of Power Microelectronics Using Classical RefrigerationVictor Chiriac; Florea Chiriac20082008, vol.130, no.4
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