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题名	作者	出版年	年卷期
Electro-Thermal Behavior of a Sub-Micrometer Bulk CMOS Device: Modeling of Heat Generation and Prediction of Temperatures	TOMOYUKI HATAKEYAMA; KAZUYOSHI FUSHINOBU	2008	2008, vol.29, no.2
Thermo-Mechanical Challenges in Stacked Packaging	DEREJE AGONAFER; ABHIJIT KAISARE; MOHAMMAD M. HOSSAIN; YONGJE LEE; BHAVANI P. DEWAN-SANDUR; TERRY DISHONGH; SENOL PEKIN	2008	2008, vol.29, no.2
Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review	CLEMENS J. M. LASANCE	2008	2008, vol.29, no.2
Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow	SUNG JIN KIM; DONG-KWON KIM; HWAN HEE OH	2008	2008, vol.29, no.2
Challenges in Cooling Design of CPU Packages for High-Performance Servers	JIE WEI	2008	2008, vol.29, no.2
A CFD Study on the Effect of Shrinking Box Size on Cooling Airflows in Compact Electronic Equipment - The Case of Portable Projection Display Equipment	LUKE MAGUIRE; WATARU NAKAYAMA; MASUD BEHNIA; YOSHIHIRO KONDO	2008	2008, vol.29, no.2
A Proper Orthogonal Decomposition Based System-Level Thermal Modeling Methodology for Shipboard Power Electronics Cabinets	SYED I. HAIDER; LUDOVIC BURTON; YOGENDRA JOSHI	2008	2008, vol.29, no.2