期刊


ISSN0145-7632
刊名Heat Transfer Engineering
参考译名传热工程
收藏年代1998~2023



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023

2008, vol.29, no.1 2008, vol.29, no.10 2008, vol.29, no.11 2008, vol.29, no.12 2008, vol.29, no.2 2008, vol.29, no.3
2008, vol.29, no.4 2008, vol.29, no.5 2008, vol.29, no.6 2008, vol.29, no.7 2008, vol.29, no.8 2008, vol.29, no.9

题名作者出版年年卷期
Electro-Thermal Behavior of a Sub-Micrometer Bulk CMOS Device: Modeling of Heat Generation and Prediction of TemperaturesTOMOYUKI HATAKEYAMA; KAZUYOSHI FUSHINOBU20082008, vol.29, no.2
Thermo-Mechanical Challenges in Stacked PackagingDEREJE AGONAFER; ABHIJIT KAISARE; MOHAMMAD M. HOSSAIN; YONGJE LEE; BHAVANI P. DEWAN-SANDUR; TERRY DISHONGH; SENOL PEKIN20082008, vol.29, no.2
Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A ReviewCLEMENS J. M. LASANCE20082008, vol.29, no.2
Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel FlowSUNG JIN KIM; DONG-KWON KIM; HWAN HEE OH20082008, vol.29, no.2
Challenges in Cooling Design of CPU Packages for High-Performance ServersJIE WEI20082008, vol.29, no.2
A CFD Study on the Effect of Shrinking Box Size on Cooling Airflows in Compact Electronic Equipment - The Case of Portable Projection Display EquipmentLUKE MAGUIRE; WATARU NAKAYAMA; MASUD BEHNIA; YOSHIHIRO KONDO20082008, vol.29, no.2
A Proper Orthogonal Decomposition Based System-Level Thermal Modeling Methodology for Shipboard Power Electronics CabinetsSYED I. HAIDER; LUDOVIC BURTON; YOGENDRA JOSHI20082008, vol.29, no.2