期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2009, vol.21, no.1 2009, vol.21, no.2 2009, vol.21, no.3 2009, vol.21, no.4

题名作者出版年年卷期
Local melt process of solder bumping by induction heating reflowHongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim20092009, vol.21, no.4
Reflow profile optimization of μBGA solder joints considering reflow temperature and time couplingTao Bo; Yin Zhouping; Ding Han; Wu Yiping20092009, vol.21, no.4
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered jointsJianbiao Pan; Tzu-Chien Chou; Jasbir Bath; Dennis Willie; Brian J. Toleno20092009, vol.21, no.4
On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parametersD. Di Maio; C. P. Hunt20092009, vol.21, no.4
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga soldersT. K. Yeh; K. L. Lin; B. Salam20092009, vol.21, no.4
Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive jointsMartin Wickham; Ling Zou; Christopher Hunt20092009, vol.21, no.4
Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspectiveKati Kokko; Hanna Harjunpaa; Anna-Maija Haltia; Pekka Heino; Minna Kellomaki20092009, vol.21, no.4
Six sigma analysis of SMD feeding parameters and board assembly qualityPekka Kytosaho; Timo Liukkonen20092009, vol.21, no.3
Reliability analysis of a novel fan-out type WLPMing-Chih Yew; Mars Tsai; Dyi-Chung Hu; Wen-Kun Yang; Kuo-Ning Chiang20092009, vol.21, no.3
Composite coating structure in an implantable electronic deviceKati Kokko; Hanna Harjunpaa; Pekka Heino; Minna Kellomaki20092009, vol.21, no.3
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