期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
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2017 2018 2019 2020 2021 2022
2023 2024

2009, vol.21, no.1 2009, vol.21, no.2 2009, vol.21, no.3 2009, vol.21, no.4

题名作者出版年年卷期
Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayerKyoo-Seok Kim; Jae-Pil Jung; Y. Norman Zhou20092009, vol.21, no.1
Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packagingStoyan Stoyanov; Chris Bailey; Marc Desmulliez20092009, vol.21, no.1
Geometry control of solder interconnects via induction heatingHongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim20092009, vol.21, no.1
Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysisChang-Chun Lee; Kuo-Chin Chang; Ya-Wen Yang20092009, vol.21, no.1



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