期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2005 2006 2007 2008 2009 2010
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2023 2024

2009, vol.21, no.1 2009, vol.21, no.2 2009, vol.21, no.3 2009, vol.21, no.4

题名作者出版年年卷期
Properties of two new medium temperature soldersChunyuan Li; Xitao Wang; Wenxia Yuan20092009, vol.21, no.2
Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticlesC. D. Zou; Y. L. Gao; B. Yang; Q. J. Zhai; C. Andersson; J. Liu20092009, vol.21, no.2
The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fieldsCong-qian Cheng; Jie Zhao; Yang Xu; Fu-Min Xu; Ming-liang Huang20092009, vol.21, no.2
Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during soldering and agingNing Zhao; Hai-tao Ma; Lai Wang20092009, vol.21, no.2
Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)M. Noren; S. Brunner; C. Hoffmann; W. Salz; K. Aichholzer20092009, vol.21, no.2
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packagesC. Andersson; B. Vandevelde; C. Noritake; P. Sun; P. E. Tegehall; D. R. Andersson; G. Wetter; J. Liu20092009, vol.21, no.2
A study of thermo-mechanical reliability of lead-free PTH solder jointsJennifer Nguyen; David Geiger; Dan Rooney; Dongkai Shangguan20092009, vol.21, no.2
Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder jointS. Chen; P. Sun; X. C. Wei; Z. N. Cheng; J. Liu20092009, vol.21, no.2



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