期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2009, vol.131, no.1 2009, vol.131, no.2 2009, vol.131, no.3 2009, vol.131, no.4

题名作者出版年年卷期
The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder BumpsJose Omar S. Amistoso; Alberto V. Amorsolo, Jr.20092009, vol.131, no.4
The Shear Test as Interface Characterization Tool Applied to the Si-BCB InterfaceDominiek Degryse; Bart Vandevelde; Eric Beyne; Joris Degrieck20092009, vol.131, no.4
Measurement of Leak Rate for MEMS Vacuum PackagingZhiyin Gan; Dexiu Huang; Xuetang Wang Dong Lin; Sheng Liu20092009, vol.131, no.4
Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy CompositesJun Zeng; Renli Fu; Simeon Agathopoulos; Shaodong Zhang; Xiufeng Song; Hong He20092009, vol.131, no.4
A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber NetworksChuen-Ching Wang; Wen-Ran Yang; Jin-Jia Chen; Wei-Wen Shi20092009, vol.131, no.4
Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au BallsWan Ho Song; Ali Karimi; Yan Huang; Michael Mayer; Norman Zhou; Jae Pil Jung20092009, vol.131, no.4
Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic ClockA. D. Laws; R. Berwick III; P. Stupar; J. DeNatale; Y. C. Lee20092009, vol.131, no.4
Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical FitsD. Bhate; G. Subbarayan; J. Zhao; V. Gupta; D. Edwards20092009, vol.131, no.4
A Novel Ceramic Packaging Technique Using Selective Induction HeatingSheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen20092009, vol.131, no.4
Novel Design of Thermal-Via Configurations for Collector-Up HBTsPei-Hsuan Lee; Hsien-Cheng Tseng; Jung-Hua Chou20092009, vol.131, no.4
1234567



制造业外文文献服务平台