期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2009, vol.131, no.1 2009, vol.131, no.2 2009, vol.131, no.3 2009, vol.131, no.4

题名作者出版年年卷期
Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale PackagesTong Hong Wang; Chang-Chi Lee; Yi-Shao Lai; Kuo-Yuan Lee20092009, vol.131, no.1
Influence of Thermomigration on Lead-Free Solder Joint Mechanical PropertiesMohd F. Abdulhamid; Cemal Basaran20092009, vol.131, no.1
Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated TransformerM. A. Neidigk; Y.-L. Shen20092009, vol.131, no.1
Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading ResistanceYen-Shu Chen; Kuo-Hsiang Chien; Yung-Shin Tseng; Yea-Kuang Chan20092009, vol.131, no.1
Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered DieAbhijit Kaisare; Dereje Agonafer; A. Haji-Sheikh; Greg Chrysler; Ravi Mahajan20092009, vol.131, no.1
Integration of Ta-N Thin Film Resistors on Anodic Alumina MCM-D SubstrateDapeng Zhu; Xiaoqin Lin; Le Luo20092009, vol.131, no.1
Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera MeasurementsJ. J. M. Zaal; W. D. van Driel; F. J. H. G. Kessels; G. Q. Zhang20092009, vol.131, no.1
A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy InterconnectsDavid M. Pierce; Sheri D. Sheppard; Paul T. Vianco20092009, vol.131, no.1
Thermal Stresses Due to Laser Welding in Bridge-Wire InitiatorsMichael R. Maughan; Robert R. Stephens; Donald M. Blackketter; Karl K. Rink20092009, vol.131, no.1
Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage AnalysisGuojun Hu; Jing-En Luan; Spencer Chew20092009, vol.131, no.1
12



制造业外文文献服务平台