期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2010, vol.22, no.1 2010, vol.22, no.2 2010, vol.22, no.3 2010, vol.22, no.4

题名作者出版年年卷期
Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experimentsGuang Zeng; Songbai Xue; Liang Zhang; Zhong Sheng; Lili Gao20102010, vol.22, no.4
Creep properties of Sn-0.7Cu composite solder joints reinforced with nano-sized Ag particlesFeng Tai; Fu Guo; Jianping Liu; Zhidong Xia; Yaowu Shi; Yongping Lei; Xiaoyan Li20102010, vol.22, no.4
Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performanceS. Mallik; M. Schmidt; R. Bauer; N. N. Ekere20102010, vol.22, no.4
An experimental and numerical investigation into the effects of the chip-on-film (COF) processing parameters on the Au-Sn bonding temperatureDe-Shin Liu; Shu-Shen Yeh; Chun-Teh Kao; Pay-Yau Huang; Chia-I Tsai; An-Hong Liu; Shu-Ching Ho20102010, vol.22, no.4
Effects of multiple BGA rework on strength of solder jointsN. Dariavach; J. Liang; G. Barr; D. Shangguan20102010, vol.22, no.4
Investigation of Sn-Zn-Bi solders - Part II: wetting measurements on Sn-Zn7Bi solders on copper and on PCBs with lead-free finishes by means of the wetting balance methodK. Bukat; J. Sitek; M. Koscielski; Z. Moser; W. Gasior; J. Pstrus20102010, vol.22, no.4
ACF curing process optimization based on degree of cure considering contact resistance degradation of jointsBo Tao; Zhouping Yin; Youlun Xiong20102010, vol.22, no.4
Thermal cycling of flip chips on FR-4 and PI substrates with parylene C coatingKati Kokko; Laura Frisk; Pekka Heino20102010, vol.22, no.3
Experimental investigation on the failure of lead-free solder joints under drop impactFang Liu; Guang Meng; Mei Zhao20102010, vol.22, no.3
Effect of ENIG deposition on the failure mechanisms of thermo mechanically loaded lead-free 2nd level interconnections in LTCC/PWB assembliesO. Nousiainen; T. Kangasvieri; K. Kautio; R. Rautioaho; J. Vahakangas20102010, vol.22, no.3
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