期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2010, vol.22, no.1 2010, vol.22, no.2 2010, vol.22, no.3 2010, vol.22, no.4

题名作者出版年年卷期
Microelectronic packaging reliability using the RSM techniqueMei-Ling Wu20102010, vol.22, no.2
Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfacesR. L. Xu; Y. C. Liu; C. Wei; L. M. Yu20102010, vol.22, no.2
Thermomechanically loaded lead-free LGA joints in LTCC/PWB assembliesOlli Nousiainen; Timo Urhonen; Tero Kangasvieri; Risto Rautioaho; Jouko Vahakangas20102010, vol.22, no.2
Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth ceriumLiang Zhang; Song-bai Xue; Li-li Gao; Yan Chen; Sheng-lin Yu; Zhong Sheng; Guang Zeng20102010, vol.22, no.2
Study of the effects of PCB surface finish on plasma process time for lead-free wave solderingG. Takyi; N. N. Ekere20102010, vol.22, no.2
Thermal fatigue behaviour of Al_2O_3-DBC substrates under high temperature cyclic loadingGuangcheng Dong; Xu Chen; Xinjian Zhang; Khai D. T. Ngo; Guo-Quan Lu20102010, vol.22, no.2



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