期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2010, vol.22, no.1 2010, vol.22, no.2 2010, vol.22, no.3 2010, vol.22, no.4

题名作者出版年年卷期
Effect of Bi on the microstructure and tensile behavior of Sn-3.7Ag soldersM. He; N. De Leon; V. L. Acoff20102010, vol.22, no.3
Investigation of Sn-Zn-Bi solders - Part I: surface tension, interfacial tension and density measurements of SnZn7Bi soldersK. Bukat; Z. Moser; J. Sitek; W. Gasior; M. Koscielski; J. Pstrus20102010, vol.22, no.3
Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma-treated HASL finish PCBsG. Takyi; N. N. Ekere20102010, vol.22, no.3
Effect of ENIG deposition on the failure mechanisms of thermo mechanically loaded lead-free 2nd level interconnections in LTCC/PWB assembliesO. Nousiainen; T. Kangasvieri; K. Kautio; R. Rautioaho; J. Vahakangas20102010, vol.22, no.3
Experimental investigation on the failure of lead-free solder joints under drop impactFang Liu; Guang Meng; Mei Zhao20102010, vol.22, no.3
Thermal cycling of flip chips on FR-4 and PI substrates with parylene C coatingKati Kokko; Laura Frisk; Pekka Heino20102010, vol.22, no.3



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