期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2010, vol.132, no.1 2010, vol.132, no.2 2010, vol.132, no.3 2010, vol.132, no.4

题名作者出版年年卷期
Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD AnalysisRoger Schmidt; Madhusudan Iyengar; Joe Caricari20102010, vol.132, no.2
Singularities at Solder Joint Interfaces and Their Effects on Fracture ModelsD. Bhate; D. Chan; G. Subbarayan; L. Nguyen; J. Zhao; D. Edwards20102010, vol.132, no.2
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric CoolersHuy N. Phan; Dereje Agonafer20102010, vol.132, no.2
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-ArchitectureSaket Karajgikar; Dereje Agonafer; Kanad Ghose; Bahgat Sammakia; Cristina Amon; Gamal Refai-Ahmed20102010, vol.132, no.2
Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and CorrelationPatrick A. Walsh; Edmond J. Walsh; Ronan Grimes20102010, vol.132, no.2
Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection SystemJin Yang; Lizheng Zhang; I. Charles Ume; Camil Ghiu; George White20102010, vol.132, no.2
An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe ArraysD. K. Harris; A. Palkar; G. Wonacott; R. Dean; F. Simionescu20102010, vol.132, no.2
Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data CenterEmad Samadiani; Jeffrey Rambo; Yogendra Joshi20102010, vol.132, no.2
Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al FilmsX. Zhao; M. Saka; M. Yamashita; F. Togoh20102010, vol.132, no.2
Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package AssemblyXi Liu; Jiantao Zheng; Suresh K. Sitaraman20102010, vol.132, no.2



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