期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2010, vol.132, no.1 2010, vol.132, no.2 2010, vol.132, no.3 2010, vol.132, no.4

题名作者出版年年卷期
Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array PackageZ. Kornain; A. Jalar; R. Rasid; S. Abdullah20102010, vol.132, no.4
Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous FluidBrett Fennell; Sangil Lee; Daniel F. Baldwin20102010, vol.132, no.4
Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding SheetYu-Tang Yen; Te-Hua Fang; Yu-Cheng Lin20102010, vol.132, no.4
The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat SinksChristopher T. DeGroot; Derek Gateman; Anthony G. Straatman20102010, vol.132, no.4
Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting DiodesChung-Feng Jeffrey Kuo; Hui-Ta Chen; Te-Li Su; Da Huang, Jr.20102010, vol.132, no.4
Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics CoolingY. Sungtaek Ju20102010, vol.132, no.4
Successive Softening and Cyclic Damage in Viscoplastic MaterialLeila J. Ladani20102010, vol.132, no.4
Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball BondingM. F. Rosle; S. Abdullah; M. A. A. Hamid; A. R. Daud; A. Jalar; Z. Kornain20102010, vol.132, no.4
Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp WavesKen-ichi Ohguchi; Katsuhiko Sasaki20102010, vol.132, no.4
Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive FilmJianhua Zhang; Jinsong Zhang; Lianqiao Yang20102010, vol.132, no.4
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