期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2011, vol.23, no.1 2011, vol.23, no.2 2011, vol.23, no.3 2011, vol.23, no.4

题名作者出版年年卷期
Effects of bulk Cu_6Sn_5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered jointsLiang Zhang; Song-bai Xue; Li-li Gao; Zhong Sheng; Wei Dai; Feng Ji; Huan Ye; Yan Chen; Sheng-lin Yu20112011, vol.23, no.1
Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixingS. L. Tay; A. S. M. A. Haseeb; Mohd Rafie Johan20112011, vol.23, no.1
Development of a lead-free solder: Sn-4.0Bi-3.7Ag-0.9ZnXun Wang; Yongchang Liu; Liming Yu; Zhizhong Dong; Zhiming Gao20112011, vol.23, no.1
Investigation of the effect of indium addition on wettability of Sn-Ag-Cu soldersZ. Moser; P. Fima; K. Bukat; J. Sitek; J. Pstrus; W. Gasior; M. Koscielski; T. Gancarz20112011, vol.23, no.1
Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assembliesO. Nousiainen; T. Kangasvieri; R. Rautioaho; J. Vahakangas20112011, vol.23, no.1
A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder jointsBo Wang; Fengshun Wu; Yiping Wu; Bing An; Hui Liu; Jian Zou20112011, vol.23, no.1



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