期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2011, vol.23, no.1 2011, vol.23, no.2 2011, vol.23, no.3 2011, vol.23, no.4

题名作者出版年年卷期
Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solderAemi Nadia; A. S. M. A. Haseeb20112011, vol.23, no.2
Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastesA. E. Marks; N. N. Ekere; S. Mallik; R. Bhatti20112011, vol.23, no.2
Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBAKong Hui Lee; Rob Jukna; Jim Altpeter; Kantesh Doss20112011, vol.23, no.2
Stability investigations of automatic X-ray inspection systemsIstvan Latos; Mihaly Janoczki20112011, vol.23, no.2
Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modulesO. Nousiainen; O. Salmela; J. Putaala; T. Kangasvieri20112011, vol.23, no.2
Effect of solder joint integrity on the thermal performance of a TEC for a 980 nm pump laser moduleG. Takyi; E. Amalu; P. K. Bernasko20112011, vol.23, no.2



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