期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2011, vol.133, no.1 2011, vol.133, no.2 2011, vol.133, no.3 2011, vol.133, no.4

题名作者出版年年卷期
The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation SimulationsNingbo Liao; Ping Yang; Miao Zhang; Wei Xue20112011, vol.133, no.2
Application of Carbon Nanotubes to Thermal Interface MaterialsDrazen Fabris; Michael Rosshirt; Christopher Cardenas; Patrick Wilhite; Toshishige Yamada; Cary Y. Yang20112011, vol.133, no.2
The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics SimulationsTarek Ragab; Cemal Basaran20112011, vol.133, no.2
Synthesis of Double Wall Carbon Nanotubes Using Sulfur as CatalystO. A. Al-Hartomy; M. A. Shah20112011, vol.133, no.2
Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix CompositesXiaobo Sun; Aiping Yu; Palanisamy Ramesh; Elena Bekyarova; Mikhail E. Itkis; Robert C. Haddon20112011, vol.133, no.2
A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging MaterialsSatish Kumar; Baratunde A. Cola; Roderick Jackson; Samuel Graham20112011, vol.133, no.2
Palladium Thiolate Bonding of Carbon Nanotube Thermal InterfacesStephen L. Hodson; Thiruvelu Bhuvana; Baratunde A. Cola; Xianfan Xu; G. U. Kulkarni; Timothy S. Fisher20112011, vol.133, no.2
Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles CalculationsFeng Gao; Jianmin Qu; Matthew Yao20112011, vol.133, no.2
Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder JointsM. Meilunas; P. Borgesen20112011, vol.133, no.2
Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface MaterialsLin Hu; William Evans; Pawel Keblinski20112011, vol.133, no.2
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