期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2011, vol.133, no.1 2011, vol.133, no.2 2011, vol.133, no.3 2011, vol.133, no.4

题名作者出版年年卷期
Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element ModelsJamil A. Wakil; Patrick W. Dehaven; Nancy R. Klymko; Shaochen Chen20112011, vol.133, no.3
Prediction of Electromigration Failure of Solder Joints and Its Sensitivity AnalysisLihua Liang; Yuanxiang Zhang; Yong Liu20112011, vol.133, no.3
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-SystemHuy N. Phan; Dereje Agonafer20112011, vol.133, no.3
Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact LoadingTong An; Fei Qin20112011, vol.133, no.3
Evaluating Life-Cycle Environmental Impact of Data CentersAmip Shah; Cullen Bash; Ratnesh Sharma; Tom Christian; Brian J. Watson; Chandrakant Patel20112011, vol.133, no.3
Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating BoardsM. O. Ozdemir; H. Yuncu20112011, vol.133, no.3
Joint Level Test Methods for Solder Pad Cratering InvestigationsBrian D. Roggeman; Venkatesh Raghavan; Peter Borgesen20112011, vol.133, no.3
From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control PhilosophyEd J. Walsh; Thomas J. Breen; Jeff Punch; Amip J. Shah; Cullen E. Bash20112011, vol.133, no.3
On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn-Pb SolderB. L. Boyce; L. N. Brewer; M. K. Neilsen; M. J. Perricone20112011, vol.133, no.3
Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit BoardsJohn H. Lau; M. S. Zhang; S. W. Ricky Lee20112011, vol.133, no.3
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