期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2011, vol.133, no.1 2011, vol.133, no.2 2011, vol.133, no.3 2011, vol.133, no.4

题名作者出版年年卷期
Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal ChannelJing He; Liping Liu; Anthony M. Jacobi20112011, vol.133, no.4
Two-Phase Microchannel Heat Sinks: Theory, Applications, and LimitationsIssam Mudawar20112011, vol.133, no.4
The Use of Potting Materials for Electronic-Packaging Survivability in Smart MunitionsN. H. Chao; J. A. Cordes; D. Carlucci; M. E. DeAngelis; Jyeching Lee20112011, vol.133, no.4
Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate ConnectionsPing Nicole An; Paul A. Kohl20112011, vol.133, no.4
Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger ArrangementAshish Sinha; Yogendra K. Joshi20112011, vol.133, no.4
Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent PropertiesChih-Sung Chen20112011, vol.133, no.4
Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260℃Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee20112011, vol.133, no.4
Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting MediumG. Lorenzini; C. Biserni; L. A. Isoldi; E. D. dos Santos; L. A. O. Rocha20112011, vol.133, no.4
Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid MetalPeipei Li; Jing Liu20112011, vol.133, no.4
Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental ResultsA. F. Askari Farahani; M. Al-Bassyiouni; A. Dasgupta20112011, vol.133, no.4
12



制造业外文文献服务平台