期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2005 2006 2007 2008 2009 2010
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2023 2024

2012, vol.24, no.1 2012, vol.24, no.2 2012, vol.24, no.3 2012, vol.24, no.4

题名作者出版年年卷期
Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer-level underfill filmTsung-Fu Yang; Kuo-Shu Kao; Ren-Chin Cheng; Jing-Yao Chang; Chau-Jie Zhan20122012, vol.24, no.4
Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solderPeng Xue; Songbai Xue; Yifu Shen; Zhengxiang Xiao; Hong Zhu; Weimin Long; Xinquan Yu20122012, vol.24, no.4
SAC 305 solder paste with carbon nanotubes - part I: Investigation of the influence of the carbon nanotubes on the SAC solder paste propertiesK. Bukat; J. Sitek; M. Koscielski; M. Jakubowska; M. Sloma; A. Mlozniak; W. Niedzwiedz20122012, vol.24, no.4
Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloyDhafer Abdul Ameer Shnawah; Suhana Binti Mohd Said; Mohd Faizul Bin Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che20122012, vol.24, no.4
Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder jointsWenzhen Bi; Guokui Ju; Fei Lin; Shifang Xie; Xicheng Wei20122012, vol.24, no.4
Surface finish effect on reliability of SAC 305 soldered chip resistorsMaurice N. Collins; Jeff Punch; Richard Coyle20122012, vol.24, no.4
The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing processLi-li Gao; Song-bai Xue; Hong Zhu20122012, vol.24, no.3
Mechanical durability of RFID chip joints assembled on flexible substratesKamil Janeczek; Tomasz Serzysko; Malgorzata Jakubowska; Grazyna Koziol; Anna Mlozniak20122012, vol.24, no.3
The effect of micro via-in pad designs on surface-mount assembly defects: Part I - TombstoningYong-Won Lee; Keun-Soo Kim; Katsuaki Suganuma20122012, vol.24, no.3
Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N_2 or exposed to air atmosphereWei Liu; Yanhong Tian; Lei Yang; Chunqing Wang; Lining Sun20122012, vol.24, no.3
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