期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2012, vol.24, no.1 2012, vol.24, no.2 2012, vol.24, no.3 2012, vol.24, no.4

题名作者出版年年卷期
Investigation of the wetting of PCBs with SnCu (HASL) and Sn_(imm) finishes by SnZnBiIn soldersKrystyna Bukat; Janusz Sitek; Marek Koscielski; Zbigniew Moser; Wladyslaw Gasior; Janusz Pstrus20122012, vol.24, no.1
A new conformal coating adhesion test for electronic assembliesLing Zou; Chris Hunt20122012, vol.24, no.1
A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder jointsDe-Shin Liu; Chang-Lin Hsu; Chia-Yuan Kuo; Ya-Ling Huang; Kwang-Lung Lin; Geng-Shin Shen20122012, vol.24, no.1
Through lifetime monitoring of solder joints using acoustic micro imagingRyan S. H. Yang; Derek R. Braden; Guang-Ming Zhang; David M. Harvey20122012, vol.24, no.1
A review of stencil printing for microelectronic packagingRobert Kay; Marc Desmulliez20122012, vol.24, no.1



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