期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2012, vol.24, no.1 2012, vol.24, no.2 2012, vol.24, no.3 2012, vol.24, no.4

题名作者出版年年卷期
Thermophysical properties and wetting behavior on Cu of selected SAC alloysPrzemyslaw Fima; Tomasz Gancarz; Janusz Pstrus; Krystyna Bukat; Janusz Sitek20122012, vol.24, no.2
Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering processChun-Sean Lau; M. Z. Abdullah; F. Che Ani20122012, vol.24, no.2
Finite element analysis of flip - chip on board (FCOB) assembly during reflowsoldering processAnnapurna Addagarla; N. Siva Prasad20122012, vol.24, no.2
Thermo-mechanical behaviour of DBC substrate assemblies subject to soldering fabrication processesDuncan Camilleri20122012, vol.24, no.2
Robot-based resistance soldering of optical componentsAlexander Gatej; Nicolas Pyschny; Peter Loosen; Christian Brecher20122012, vol.24, no.2
Mechanical property evaluation of nano-silver paste sintered joint using lap-shear testXin Li; Gang Chen; Xu Chen; Guo-Quan Lu; Lei Wang; Yun-Hui Mei20122012, vol.24, no.2
Developing a model for the bond heel lifetime prediction of thick aluminium wire bondsLutz Merkle; Marcus Sonner; Matthias Petzold20122012, vol.24, no.2



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