期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2012, vol.24, no.1 2012, vol.24, no.2 2012, vol.24, no.3 2012, vol.24, no.4

题名作者出版年年卷期
Systematic mechanical design approach for a flexible printed circuit board assemblies (PCBA) rework cell: part II - conceptual design of soldering and desoldering systemNecdet Geren; Cagdas Sar-gul; Melih Bayramoglu20122012, vol.24, no.3
Three-dimensional thermal investigations at board level in a reflow oven using thermal-coupling methodChun-Sean Lau; M. Z. Abdullah; F. Che Ani20122012, vol.24, no.3
Enhanced solder wettability of oxidized-copper with lead-free solder via Ar-H_2 plasmas for flip-chip bumping: the effects of H_2 flow ratesY. S. Lin; W. J. Lin; L. Y. Chiu20122012, vol.24, no.3
Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N_2 or exposed to air atmosphereWei Liu; Yanhong Tian; Lei Yang; Chunqing Wang; Lining Sun20122012, vol.24, no.3
The effect of micro via-in pad designs on surface-mount assembly defects: Part I - TombstoningYong-Won Lee; Keun-Soo Kim; Katsuaki Suganuma20122012, vol.24, no.3
Mechanical durability of RFID chip joints assembled on flexible substratesKamil Janeczek; Tomasz Serzysko; Malgorzata Jakubowska; Grazyna Koziol; Anna Mlozniak20122012, vol.24, no.3
The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing processLi-li Gao; Song-bai Xue; Hong Zhu20122012, vol.24, no.3



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