期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2012, vol.134, no.1 2012, vol.134, no.2 2012, vol.134, no.3 2012, vol.134, no.4

题名作者出版年年卷期
Impact of Self-Assembly Process Errors on Thermoelectric PerformanceNathan B. Crane; Patrick McKnight20122012, vol.134, no.3
Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected DevicesThomas Fellner; Elena Zukowski; Jurgen Wilde; H. Kuck; H. Richter; M. Schober; P. Buckmuller20122012, vol.134, no.3
Study of Solder/Copper Interface Behavior Under Varying Strain RatesY. W. Kwon; A. M. Luteran; J. M. Didoszak; A. S. Kwon20122012, vol.134, no.3
Parameter Calibrations on MOSFET Stress SensorsRen-Tzung Tan; Hsien Chung; Ben-Je Lwo; Chun-Pai Tang; Kun-Fu Tseng20122012, vol.134, no.3
Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink ClampingJordan C. Roberts; Mohammad Motalab; Safina Hussain; Jeffrey C. Suhling; Richard C. Jaeger; Pradeep Lall20122012, vol.134, no.3
Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical ResistanceB. Fiedler; M. Fine; K. Kao; L. Keer20122012, vol.134, no.3
Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending EffectX. C. Chen; Bo Tao; Z. P. Yin20122012, vol.134, no.3
Norris-Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free ElectronicsPradeep Lall; Aniket Shirgaokar; Dinesh Arunachalam20122012, vol.134, no.3
Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon RefrigerantsSarah Kim; Yoon Jo Kim; Yogendra K. Joshi; Andrei G. Fedorov; Paul A. Kohl20122012, vol.134, no.3
Effect of Shield-Can on Dynamic Response of Board-Level AssemblyDa Yu; Jae Kwak; Seungbae Park; Soonwan Chung; Ji-Young Yoon20122012, vol.134, no.3
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