期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2013, vol.25, no.1 2013, vol.25, no.2 2013, vol.25, no.3 2013, vol.25, no.4

题名作者出版年年卷期
The effect of micro via-in pad design on surface-mount assembly defects: part II - voiding and spatteringYong-Won Lee; Keun-Soo Kim; Katsuaki Suganuma20132013, vol.25, no.1
Interfacial reaction of a Sn-3.0Ag-0.5Cu thin film during solder reflowLiu Mei Lee; Habsah Haliman; Ahmad Azmin Mohamad20132013, vol.25, no.1
Solder joint degradation and detection using RF impedance analysisYao Bin; Lu Yudong; Wan Ming20132013, vol.25, no.1
Solidification and reliability of lead-free solder interconnectionHao Yu; Dongkai Shangguan20132013, vol.25, no.1
Surface oxide analysis of lead-free solder particlesXin Luo; Wenhui Du; Xiuzhen Lu; Toshikazu Yamaguchi; Gavin Jackson; Li lei Ye; Johan Liu20132013, vol.25, no.1
Fluidic aligned, dense SWNTs arrays as potential die adhesive and thermal interface materialHao Rong; Baoming Wang; Wei-Qing Lin; Lichao Sun; Jin-Cheng Zheng; Miao Lu20132013, vol.25, no.1



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