期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2013, vol.25, no.1 2013, vol.25, no.2 2013, vol.25, no.3 2013, vol.25, no.4

题名作者出版年年卷期
SAC solder paste with carbon nanotubes Part II: carbon nanotubes' effect on solder joints' mechanical properties and microstructureKrystyna Bukat; Janusz Sitek; Marek Koscielski; Wojciech Niedzwiedz; Anna Mlozniak; Malgorzata Jakubowska20132013, vol.25, no.4
Cu filling of TSV using various current forms for three-dimensional packaging applicationMyong-Hoon Roh; Jun-Hyeong Lee; Wonjoong Kim; Jea Pil Jung20132013, vol.25, no.4
A study into the re-processing of pure tin termination finishes into tin-leadIan C. Turner; Barrie D. Dunn; Cathy Barnes20132013, vol.25, no.4
A review: influence of nano particles reinforced on solder alloyErvina Efzan Mhd Noor; Amares Singh; Yap Tze Chuan20132013, vol.25, no.4
Ultra-short vertically aligned carbon nanofibers transfer and application as bonding materialSi Chen20132013, vol.25, no.4



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