期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2013, vol.135, no.1 2013, vol.135, no.2 2013, vol.135, no.3 2013, vol.135, no.4

题名作者出版年年卷期
Investigation on Laser Direct Welding of Quad Flat Pack ComponentsJianwen Yuan; Chao Huang; Jimin Chen; Furong Liu; Yi Qiu20132013, vol.135, no.4
Experimental and Modeling Studies of Looping Process for Wire BondingFuliang Wang; Yun Chen20132013, vol.135, no.4
A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal ConditionsBo Tao; Guanghua Wu; Zhouping Yin; Youlun Xiong20132013, vol.135, no.4
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment MethodGuofeng Xia; Fei Qin; Cha Gao; Tong An; Wenhui Zhu20132013, vol.135, no.4
Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-ViasAnjali Chauhan; Bahgat Sammakia; Furat F. Afram; Kanad Ghose; Gamal Refai-Ahmed; Dereje Agonafer20132013, vol.135, no.4
Hygromechanical Analysis of Liquid Crystal Display PanelsToru Ikeda; Tomonori Mizutani; Kiyoshi Miyake; Noriyuki Miyazaki20132013, vol.135, no.4
Variable-Length Link-Spring Model for Kink Formation During Wire BondingFuliang Wang; Weidong Tang; Junhui Li; Lei Han20132013, vol.135, no.4
Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser DiodeYi Yan; Youliang Guan; Xu Chen; Guo-Quan Lu20132013, vol.135, no.4
A Stepped-Bar Apparatus for Thermal Resistance MeasurementsDakotah R. Thompson; Sameer R. Rao; Baratunde A. Cola20132013, vol.135, no.4
Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal ModulesSe-Chang Kim; Dae-Geun Cho; Tae-Gyu Kim; Se-Hun Jung; Ja-Choon Koo; Moon-Ki Kim; Jae-Boong Choi20132013, vol.135, no.4
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