期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2013, vol.135, no.1 2013, vol.135, no.2 2013, vol.135, no.3 2013, vol.135, no.4

题名作者出版年年卷期
Improved Computational Fluid Dynamics Model for Open-Aisle Air-Cooled Data Center SimulationsWaleed A. Abdelmaksoud; Thong Q. Dang; H. Ezzat Khalifa; Roger R. Schmidt20132013, vol.135, no.3
Rack Level Modeling of Air Flow Through Perforated Tile in a Data CenterVaibhav K. Arghode; Pramod Kumar; Yogendra Joshi; Thomas Weiss; Gary Meyer20132013, vol.135, no.3
Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data CentersDavid J. Lettieri; Michael M. Toulouse; Cullen E. Bash; Amip J. Shah; Van P. Carey20132013, vol.135, no.3
Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test CellEthan Cruz; Yogendra Joshi20132013, vol.135, no.3
A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data CenterSrinarayana Nagarathinam; Babak Fakhim; Masud Behnia; Steve Armfield20132013, vol.135, no.3
Thermally Aware, Energy-Based Load Placement in Open-Aisle, Air-Cooled Data CentersDustin W. Demetriou; H. Ezzat Khalifa20132013, vol.135, no.3
Expanded Assessment of a Practical Thermally Aware Energy-Optimized Load Placement Strategy for Open-Aisle, Air-Cooled Data CentersDustin W. Demetriou; H. Ezzat Khalifa20132013, vol.135, no.3
Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental EvaluationNicolas Lamaison; Jackson Braz Marcinichen; John Richard Thome20132013, vol.135, no.3
High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic DevicesMaxat N. Touzelbaev; Josef Miler; Yizhang Yang; Gamal Refai-Ahmed; Kenneth E. Goodson20132013, vol.135, no.3
Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G ApplicationsNien-Hua Chao; John A. Dispenza; Mario DeAngelis20132013, vol.135, no.3
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