期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2014, vol.26, no.1 2014, vol.26, no.2 2014, vol.26, no.3 2014, vol.26, no.4

题名作者出版年年卷期
Comparing 2D and 3D numerical simulation results of gas flow velocity in convection reflow ovenBalazs Illes20142014, vol.26, no.4
Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase solderingOliver Krammer20142014, vol.26, no.4
Effects of aging on microstructure evolution and mechanical properties of high-temperature Zn-4Al-3Mg solderHuan Wang; Yongchang Liu; Huixia Gao; Zhiming Gao20142014, vol.26, no.4
Contamination profile on typical printed circuit board assemblies vs soldering processHelene Conseil; Morten Stendahl Jellesen; Rajan Ambat20142014, vol.26, no.4
Failure analysis on electrolytic Ni/Au surface finish of PCB used for wire bonding and solderingFei-Jun Chen; Shi Yan; Zhen-Guo Yang20142014, vol.26, no.4
Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageingGuokui Ju; Fei Lin; Wenzhen Bi; Yongjiu Han; Wang Junjie; Xicheng Wei20142014, vol.26, no.4
Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurementWeisheng Xia; Ming Xiao; Yihao Chen; Fengshun Wu; Zhe Liu; Hongzhi Fu20142014, vol.26, no.3
Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloysErvina Efzan Mhd Noor; Amares Singh20142014, vol.26, no.3
Tin oxide coverage on tin whisker surfaces, measurements and implications for electronic circuitsBarrie D. Dunn; Grazyna Mozdzen20142014, vol.26, no.3
Solder joint imagery compressing and recovery based on compressive sensingHuihuang Zhao; Yaonan Wang; Zhijun Qiao; Bin Fu20142014, vol.26, no.3
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