期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2014, vol.26, no.1 2014, vol.26, no.2 2014, vol.26, no.3 2014, vol.26, no.4

题名作者出版年年卷期
Influence of the fluxes properties on quality and the microstructure of lead-free solder joints executed by selective solderingMarek Koscielski; Janusz Sitek20142014, vol.26, no.1
Voids investigation in solder joints performed with vapour phase soldering (VPS)Beata Kinga Synkiewicz; Agata Skwarek; Krzysztof Witek20142014, vol.26, no.1
Characterization of nano-enhanced interconnect materials for fine pitch assemblyYan Zhang; Janusz Sitek; Jing-yu Fan; Shiwei Ma; Marek Koscielski; Lilei Ye; Johan Liu20142014, vol.26, no.1
Electrodeposition of thin metallic layer for solar cell electrodesKazimierz Drabczyk; Robert Socha; Piotr Panek; Grzegorz Mordarski20142014, vol.26, no.1
Combined loading and failure analysis of lead-free solder joints due to creep and fatigue phenomenaKrystian Jankowski; Artur Wymyslowski; Didier Chicot20142014, vol.26, no.1
Reliability investigations for high temperature interconnectsRainer Dudek; Peter Sommer; Andreas Fix; Joerg Trodler; Sven Rzepka; Bernd Michel20142014, vol.26, no.1



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