期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2014, vol.26, no.1 2014, vol.26, no.2 2014, vol.26, no.3 2014, vol.26, no.4

题名作者出版年年卷期
Temperature cycling with Peltier elements of boards with SMD components and failure evaluationJosef Sandera; Michal Nicak20142014, vol.26, no.2
Reliability analysis of an ACA attached flex-on-board assembly for industrial applicationJanne Kiilunen; Laura Frisk20142014, vol.26, no.2
Statistical analysis of stencil technology for wafer-level bumpingRobert W. Kay; Gerard Cummins; Thomas Krebs; Richard Lathrop; Eitan Abraham; Marc Desmulliez20142014, vol.26, no.2
Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solutionLiu Mei Lee; Muhammad Firdaus Mohd Nazeri; Habsah Haliman; Ahmad Azmin Mohamad20142014, vol.26, no.2
Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflowJ. Mittal; K. L. Lin20142014, vol.26, no.2



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