期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2014, vol.136, no.1 2014, vol.136, no.2 2014, vol.136, no.3 2014, vol.136, no.4

题名作者出版年年卷期
Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile ApplicationsMirza, Fahad; Naware, Gaurang; Jain, Ankur; Agonafer, Dereje20142014, vol.136, no.4
Design and Control of the IBM Power 775 Supercomputer Water Conditioning UnitEllsworth, Michael J., Jr.; Zoodsma, Randy J.; Cascio, Frank; Behrendt, Eileen20142014, vol.136, no.4
UCPD Model for Pb-Free SolderNeilsen, Michael K.; Vianco, Paul T.20142014, vol.136, no.4
Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded ElectrodesTaylor, Stephen H.; Garimella, Suresh V.20142014, vol.136, no.4
Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric GeneratorsXu, Xinqiang; Zhou, Siyi; Meyers, Mark M.; Sammakia, Bahgat G.; Murray, Bruce T.20142014, vol.136, no.4
Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb SystemsPetroski, James20142014, vol.136, no.4
Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal FoamsShirazy, Mahmood R. S.; Frechette, Luc G.20142014, vol.136, no.4
Strain Transfer Analysis of Integrated Surface Acoustic Wave SensorsHempel, Jochen; Anees, Sohaib; Zukowski, Elena; Berndt, Michael; Wilde, Juergen; Reindl, Leonhard M.20142014, vol.136, no.4
Design of Thermoelectric Modules for High Heat Flux CoolingRanjan, Ram; Turney, Joseph E.; Lents, Charles E.; Faustino, Virginia H.20142014, vol.136, no.4
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit IntegrationLau, John H.20142014, vol.136, no.4
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