期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2014, vol.136, no.1 2014, vol.136, no.2 2014, vol.136, no.3 2014, vol.136, no.4

题名作者出版年年卷期
Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder JointsTong An; Fei Qin; Guofeng Xia20142014, vol.136, no.1
Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting ModulesKyoung Joon Kim20142014, vol.136, no.1
Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface FinishesChaoran Yang; Fubin Song; S. W. Ricky Lee20142014, vol.136, no.1
A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid SystemsJason Stafford; David Newport; Ronan Grimes20142014, vol.136, no.1
Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow UnderfillSangil Lee; Daniel F. Baldwin20142014, vol.136, no.1
The Strength of High-Temperature Ag-In Joints Produced Between Copper by Fluxless Low-Temperature ProcessesYuan-Yun Wu; Chin C. Lee20142014, vol.136, no.1
A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered DevicesJ. H. L. Ling; A. A. O. Tay20142014, vol.136, no.1
Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling ApproachesJason Stafford; Florian Fortune20142014, vol.136, no.1
Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone OilShengfu Mei; Yunxia Gao; Zhongshan Deng; Jing Liu20142014, vol.136, no.1
Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting DiodesSun-Min Kim; Kwang-Yong Kim20142014, vol.136, no.1
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