期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2014, vol.136, no.1 2014, vol.136, no.2 2014, vol.136, no.3 2014, vol.136, no.4

题名作者出版年年卷期
Thermal Performance of a Water-Cooled Microchannel Heat Sink With Grooves and ObstaclesYonghui Xie; Zhongyang Shen; Di Zhang; Jibing Lan20142014, vol.136, no.2
Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design ApproachYubai Li; Dongzhi Guo; Shi-Chune Yao20142014, vol.136, no.2
Thermal Management of Time-Varying High Heat Flux Electronic DevicesT. David; D. Mendler; A. Mosyak; A. Bar-Cohen; G. Hetsroni20142014, vol.136, no.2
Development of a Mini Heat Sink Model With Homogeneous Heat Transfer CapabilityJ. F. Zhou20142014, vol.136, no.2
An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/ProtrusionsDi Zhang; Lu Zheng; Gongnan Xie; Yonghui Xie20142014, vol.136, no.2
Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip StacksYassir Madhour; Brian P. d'Entremont; Jackson Braz Marcinichen; Bruno Michel; John Richard Thome20142014, vol.136, no.2
Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated CircuitsDaniel Lorenzini-Gutierrez; Satish G. Kandlikar20142014, vol.136, no.2
Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power DistributionJun Jie Liu; Hua Zhang; S. C. Yao; Yubai Li20142014, vol.136, no.2
Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated CircuitsSatish G. Kandlikar20142014, vol.136, no.2
Advances in the Fabrication Processes and Applications of Wafer Level PackagingPeisheng Liu; Jinlan Wang; Liangyu Tong; Yujuan Tao20142014, vol.136, no.2
12



制造业外文文献服务平台