期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2014, vol.136, no.1 2014, vol.136, no.2 2014, vol.136, no.3 2014, vol.136, no.4

题名作者出版年年卷期
High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without FluxFuliang Wang; Junhui Li; Lei Han20142014, vol.136, no.3
HDPE Matrix Composites Filled With Ca_4La_6(SiO_4)_4(PO_4)_2O_2 for Microwave Substrate ApplicationsDhanesh Thomas; Mailadil T. Sebastian20142014, vol.136, no.3
Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating PlateEsam M. Alawadhi20142014, vol.136, no.3
Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker GrowthKenny Mahan; Yong Sun; Bongtae Han; Sungwon Han; Mike Osterman20142014, vol.136, no.3
Determination of the Lumped-Capacitance Parameters of Air-Cooled Servers Through Air Temperature MeasurementsHamza Salih Erden; H. Ezzat Khalifa; Roger R. Schmidt20142014, vol.136, no.3
Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg MicrobumpsChang-Chun Lee; Po Ting Lin20142014, vol.136, no.3
Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection MethodsSungbum Kang; I. Charles Ume20142014, vol.136, no.3
Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array ComponentsBenjamin Giron-Palomares; Xin Fu; Abel Hernandez-Guerrero; Bladimir Ramos-Alvarado20142014, vol.136, no.3
Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic CoolingXiaohong Hao; Bei Peng; Gongnan Xie; Yi Chen20142014, vol.136, no.3
A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling SystemsA. Gholami; M. Ahmadi; M. Bahrami20142014, vol.136, no.3
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