期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2014, vol.136, no.1 2014, vol.136, no.2 2014, vol.136, no.3 2014, vol.136, no.4

题名作者出版年年卷期
Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting MaterialsMeguid, S. A.; Zhuo, Chen; Yang, Fan20142014, vol.136, no.4
Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current DensitySasagawa, Kazuhiko; Unuma, Jun; Fujisaki, Kazuhiro; Azuma, Ryota20142014, vol.136, no.4
Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary BridgingBrunschwiler, Thomas; Schlottig, Gerd; Ni, Songbo; Liu, Yu; Goicochea, Javier V.; Zuercher, Jonas; Wolf, Heiko20142014, vol.136, no.4
Four-Wire Bridge Measurements of Silicon van der Pauw Stress SensorsJaeger, Richard C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C.20142014, vol.136, no.4
Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under VibrationLall, Pradeep; Lowe, Ryan20142014, vol.136, no.4
Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface FastenerTeshima, Hiromasa; Kojima, Kohei; Ju, Yang20142014, vol.136, no.4
Special Section on InterPACK 2013Chaparala, Satish; Gupta, Ashish; Hoivik, Nils; Lee, Y. C.20142014, vol.136, no.4
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit IntegrationLau, John H.20142014, vol.136, no.4
Design of Thermoelectric Modules for High Heat Flux CoolingRanjan, Ram; Turney, Joseph E.; Lents, Charles E.; Faustino, Virginia H.20142014, vol.136, no.4
Strain Transfer Analysis of Integrated Surface Acoustic Wave SensorsHempel, Jochen; Anees, Sohaib; Zukowski, Elena; Berndt, Michael; Wilde, Juergen; Reindl, Leonhard M.20142014, vol.136, no.4
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