期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2015, vol.27, no.1 2015, vol.27, no.2 2015, vol.27, no.3 2015, vol.27, no.4

题名作者出版年年卷期
Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effectsKwak, Jae B.; Chung, Soonwan20152015, vol.27, no.1
Effect of Au-Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder jointsLiu, Wei; An, Rong; Wang, Chunqing; Tian, Yanhong20152015, vol.27, no.1
Research and prospect of binary high-temperature Pb-free soldersDu, Yunfei; Li, Chuntian; Huang, Bin; Tang, Ming; Du, Changhua20152015, vol.27, no.1
Electrical and mechanical properties of RFID chip joints assembled on flexible substratesJaneczek, Kamil; Jakubowska, Malgorzata; Koziol, Grazyna; Mlozniak, Anna20152015, vol.27, no.1
A new approach to investigate conductive anodic filament (CAF) formationZou, Ling Chunxian; Hunt, Chris20152015, vol.27, no.1
Thermal fluid-structure interaction of PCB configurations during the wave soldering processAziz, M. S. Abdul; Abdullah, M. Z.; Khor, C. Y.20152015, vol.27, no.1
Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder jointBernasko, Peter K.; Mallik, Sabuj; Takyi, G.20152015, vol.27, no.1
Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effectsKwak, Jae B.; Chung, Soonwan20152015, vol.27, no.1
Effect of Au-Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder jointsLiu, Wei; An, Rong; Wang, Chunqing; Tian, Yanhong20152015, vol.27, no.1
Research and prospect of binary high-temperature Pb-free soldersDu, Yunfei; Li, Chuntian; Huang, Bin; Tang, Ming; Du, Changhua20152015, vol.27, no.1
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