期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2015, vol.27, no.1 2015, vol.27, no.2 2015, vol.27, no.3 2015, vol.27, no.4

题名作者出版年年卷期
Realistic warpage evaluation of printed board assembly during reflow processChung, Soonwan; Kwak, Jae B.20152015, vol.27, no.4
Relative effect of solder flux chemistry on the humidity related failures in electronicsVerdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan20152015, vol.27, no.4
Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond applicationPeng, Hui Yuen; Devarajan, Mutharasu; Lee, Teik Toon; Lacey, David20152015, vol.27, no.4
Bonding of zero-shrink LTCC with alumina ceramicsSomer, Jakub; Stekovic, Michal; Urban, Frantisek; Sandera, Josef; Szendiuch, Ivan20152015, vol.27, no.4
Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packagingGao, Lilan; Gao, Hong; Chen, Xu20152015, vol.27, no.4
The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assembliesTian, Ye; Chow, Justin; Liu, Xi; Sitaraman, Suresh K.20152015, vol.27, no.4
Thermal cycling aging effects on the ratcheting behavior of anisotropic conductive filmGao, Hong; Ma, Jianhua; Gao, Lilan; Yu, Dunji; Sun, Jinsheng20152015, vol.27, no.4



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