期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2015, vol.137, no.1 2015, vol.137, no.2 2015, vol.137, no.3 2015, vol.137, no.4

题名作者出版年年卷期
Effect of a Slotted Shield on Thermal and Hydraulic Performance of a Heat SinkElsayed, Mohamed L.; Mesalhy, Osama20152015, vol.137, no.1
On-Chip Power Generation Using Ultrathin Thermoelectric GeneratorsSullivan, Owen; Gupta, Man Prakash; Mukhopadhyay, Saibal; Kumar, Satish20152015, vol.137, no.1
Optimization of Thermoelectric Coolers for Hotspot Cooling in Three-Dimensional Stacked ChipsRedmond, Matthew; Kumar, Satish20152015, vol.137, no.1
Experimental Characterization of Various Cold Aisle Containment Configurations for Data CentersSundaralingam, Vikneshan; Arghode, Vaibhav K.; Joshi, Yogendra; Phelps, Wally20152015, vol.137, no.1
Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced MicrogapHan, Xuefei; Joshi, Yogendra K.20152015, vol.137, no.1
Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data CenterArghode, Vaibhav K.; Joshi, Yogendra20152015, vol.137, no.1
Modeling and Experimental Study of a Wire Clamp for Wire BondingWang, Fuliang; Fan, Dengke20152015, vol.137, no.1
Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental InvestigationLadani, Leila; Abdelhadi, Ousama20152015, vol.137, no.1
A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the SubstrateLing, J. H. L.; Tay, A. A. O.20152015, vol.137, no.1
Two-Phase Thermal Ground Planes: Technology Development and Parametric ResultsBar-Cohen, Avram; Matin, Kaiser; Jankowski, Nicholas; Sharar, Darin20152015, vol.137, no.1
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