期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2015, vol.137, no.1 2015, vol.137, no.2 2015, vol.137, no.3 2015, vol.137, no.4

题名作者出版年年卷期
Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without NanoparticlesRoy, Ajit K.; Ganguli, Sabyasachi; Banerjee, Rupak K.; Al-Rjoub, Marwan F.20152015, vol.137, no.2
Analysis of Using Ferrofluid as an Interface Material in a Field Reversible Thermal ConnectorYousif, Ahmed S.; Solbrekken, Gary L.20152015, vol.137, no.2
Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle FilterLall, Pradeep; Zhang, Hao20152015, vol.137, no.2
A Computational and Experimental Investigation of Synthetic Jets for Cooling of ElectronicsArik, Mehmet; Utturkar, Yogen V.20152015, vol.137, no.2
Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics CoolingChougule, Sandesh S.; Sahu, S. K.20152015, vol.137, no.2
Steady State and Transient Experimentally Validated Analysis of Hybrid Data CentersGao, Tianyi; Sammakia, Bahgat; Samadiani, Emad; Schmidt, Roger20152015, vol.137, no.2
Thermal Cycling Study of Quilt PackagingKhan, M. Ashraf; Zheng, Quanling; Kopp, David; Buckhanan, Wayne; Kulick, Jason M.; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H.20152015, vol.137, no.2
Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under MicrogravityThiagarajan, Naveenan; Bhavnani, Sushil H.; Narayanan, Vinod20152015, vol.137, no.2
Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle ContainmentAlkharabsheh, Sami A.; Sammakia, Bahgat G.; Shrivastava, Saurabh K.20152015, vol.137, no.2
Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip StackJohnson, R. W.; Shen, Y. -L.20152015, vol.137, no.2
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