期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2016, vol.28, no.1 2016, vol.28, no.2 2016, vol.28, no.3 2016, vol.28, no.4

题名作者出版年年卷期
Thermo- mechanical challenges of reflowed lead-free solder joints in surface mount components: a reviewLau, Chun Sean; Khor, C. Y.; Soares, D.; Teixeira, J. C.; Abdullah, M. Z.20162016, vol.28, no.2
Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integrationXiao, Ming; Munief, Walid Madhat; Wu, Fengshun; Lilischkis, Rainer; Oberbillig, Tobias; Saumer, Monika; Xia, Weisheng20162016, vol.28, no.2
An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solderTang, Zirong; Wu, Fengshun; Chen, Guang; Huang, Bomin; Liu, Hui; Chan, Y. C.20162016, vol.28, no.2
A grey-ANN approach for optimizing the QFN component assembly process for smart phone applicationHuang, Chien-Yi; Chen, Ching-Hsiang; Lin, Yueh-Hsun20162016, vol.28, no.2
Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and GeNobari, Amir Hossein; Maalekian, Mehran; Seelig, Karl; Pekguleryuz, Mihriban20162016, vol.28, no.2
Time-based reflow soldering optimization by using adaptive Kriging-HDMR methodChen, Liming; Li, Enying; Wang, Hu20162016, vol.28, no.2
Compressive sensing for noisy solder joint imagery based on convex optimizationZhao, Huihuang; Chen, Jianzhen; Xu, Shibiao; Wang, Ying; Qiao, Zhijun20162016, vol.28, no.2



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