期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2016, vol.138, no.1 2016, vol.138, no.2 2016, vol.138, no.3 2016, vol.138, no.4

题名作者出版年年卷期
Flow Boiling in Microgaps for Thermal Management of High Heat Flux MicrosystemsHan, Xuefei; Fedorov, Andrei; Joshi, Yogendra20162016, vol.138, no.4
Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film MaterialsZhao, Dongliang; Qian, Xin; Gu, Xiaokun; Jajja, Saad Ayub; Yang, Ronggui20162016, vol.138, no.4
Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental ConditionsMahan, Kenny; Rosen, David; Han, Bongtae20162016, vol.138, no.4
Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock ResponseKallolimath, Sharan; Zhou, Jiang Jenny20162016, vol.138, no.4
Modular Microfluidic Filters Based on Transparent MembranesArchibong, E.; Tuazon, H.; Wang, H.; Winskas, J.; Pyayt, A. L.20162016, vol.138, no.4
Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric MaterialsFeng, Dudong; Yao, Shi-Chune; Zhang, Tian; Zhang, Qiming20162016, vol.138, no.4
Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal AgingZhu, Yan; Sun, Fenglian20162016, vol.138, no.4
Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid-Solid Reaction CouplesHsu, Shou-Jen; Lee, Chin C.20162016, vol.138, no.4
Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics ModuleGess, Joshua; Bhavnani, Sushil; Johnson, R. Wayne20162016, vol.138, no.4
A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat ConductionChen, Cheng; Geer, James; Sammakia, Bahgat20162016, vol.138, no.4
12



制造业外文文献服务平台